Finetech en-gb Copyright Mon, 20 Sep 2021 16:06:13 +0200 Mon, 20 Sep 2021 16:06:13 +0200 news-215 Tue, 06 Jul 2021 08:15:46 +0200 Finetech GmbH & Co. KG Announced Change in the Management At the end of the 2020/2021 fiscal year, there was a change in the management of Finetech GmbH & Co. KG. Carlotta Baumann took over as leader from long-time CEO Gunter Kürbis. Gunter Kürbis was head of Finetech GmbH & Co. KG since 1999 and during this time successfully transformed the Berlin-based mechanical engineering company into a leading global manufacturer of high-precision assembly and rework systems for customers in the microelectronics industry. Under Mr. Kürbis’ leadership, Finetech expanded with several sales & service offices in North America and Asia, followed by the move of the Berlin headquarters to a state-of-the-art production and development center in 2015.

Now Gunter Kürbis has passed the baton to the next generation. Carlotta Baumann is the first woman to take the position of managing director at Finetech GmbH & Co. KG. She has already been working in the same capacity for the rework and dispensing specialist MARTIN GmbH, a subsidiary of Finetech, since 2016.

For Carlotta Baumann, the move to Berlin marks a return to familiar territory. She once completed her master's degree in electrical engineering in the German capital, and Finetech is already well known to her through numerous work stays.

Carlotta Baumann: "First of all, my heartfelt thanks go to Gunter Kürbis, who significantly and with great commitment has shaped Finetech's success story. Taking over the management of Finetech now is a task that I am very much looking forward to. We are celebrating our 30th anniversary at Finetech this fiscal year and have a lot planned. Our customers can look forward to exciting new products that continue to cover the entire spectrum of applications from R&D labs to automated production environments. Finetech will continue to be their strong equipment partner on the journey from product development to industrial automated production."

news-214 Mon, 21 Jun 2021 12:04:52 +0200 Automated die bonder FINEPLACER® femto blu is a cost-efficient solution for dedicated photonics production Finetech, a leading provider of precision bonders and advanced rework equipment, announces the latest addition to the FINEPLACER® family, the FINEPLACER® femtoblu  die bonding system. This automated micro assembly cell is an efficient and economical solution for dedicated photonics production. These demanding applications will benefit from a placement accuracy of 2.0 µm @ 3 Sigma and ultra-low force bonding capability down to 0.05 N. Designed for prototyping and high-yield production duties, the system supports all bonding technologies specifically required for the assembly of e.g. Silicon Photonics and photonic/ optoelectronic components in the field of data and telecommunications, high power lasers and other industrial semiconductors, as well as 3D sensors/ LiDAR for augmented reality, automotive applications and many more.

Depending on specific needs, the modular FINEPLACER® femtoblu can be individually configured and upgraded in-field to support additional applications and technologies.
A complete machine enclosure with optional HEPA filter minimizes external influences to ensure a stable process environment and protects the operator against gas, vapor and UV radiation.

The “DualCam” visual alignment system provides application-specific fields of view, digital zoom, and delivers optics shifting along the X-axis for optimal viewing of a wide spectrum of component sizes. The dual camera module ensures very high angular accuracy during alignment and almost completely eliminates coupling losses due to twisted components. Various LED lighting options ensure optimum contrast ratios at all times and support highly stable processes.


Process optimization with software power

IPM Command, the advanced FINEPLACER® operating software, supports a consistent, ergonomic and clearly structured process development. It enables the synchronized control of all process parameters and additional process modules and provides pattern recognition for the automated alignment of substrates and components based on their structures and patterns.

IPM Command offers an unparalleled range and depth of user intervention options for process control and optimization. This allows sophisticated alignment and assembly processes of the highest quality.


Seamless transition from R&D to production

The FINEPLACER® femtoblu follows Finetech's "Prototype to Production" approach of a hardware and software platform that is consistent across FINEPLACER® machines of the new generation. It enables R&D processes to be seamlessly transferred in all their technological diversity from the development lab to the production environment. This opens up adapted product development strategies with minimized financial risk, especially for users with small and uncertain development projects.

They start their development projects with a comparatively low initial investment on a manual FINEPLACER® R&D bonder. In the creative phase, they benefit from the open design and all the freedom of a versatile and highly adaptable development system. Once the new product is ready for production, the R&D processes are transferred to a FINEPLACER® production system and automated without additional development effort. For example, this can be the FINEPLACER® femtoblu, which enables product developers to cost-effectively enter the fully automated production of innovative photonics products.

Learn more about the FINEPLACER® femtoblu at CIOE 2021, booth #14C61-1, and at Productronica 2021, hall B2, booth #411.

news-212 Tue, 08 Jun 2021 09:26:26 +0200 Quantum sensors for innovative measurement technology Finetech supports BMBF-funded "Quamapolis“ development project with high-precision placement and assembly systems for the integration of micro-optical components. A joint project called "Quamapolis", funded by the German Federal Ministry of Education and Research (BMBF) within the framework program "Quantum Technologies - from Fundamentals to Market", has started work. The ambitious goal: to develop a compact vector magnetometer based on quantum effects in diamond within three years. The combination of targeted generation of a reference magnetic field and vector magnetic field measurement allows precise localization and determination of the position of objects, which is essential for the further automation of processes in the context of Industry 4.0, smart home and robotics applications in the field of healthcare and smart agriculture.

The joint project involves members from industry and science, namely Robert Bosch GmbH, Q.ant GmbH, Würth Elektronik GmbH & Co. KG as well as the universities in Stuttgart and Ulm. Other associated project partners include Daimler AG and Bosch Sensortec GmbH.


High-precision integration of micro-optical components on systems from Finetech

During the development of the vector magnetometer, for the first time all components required for the function, such as laser diode, diamond, optical filter, photodetector and a circuit for generating a microwave field, are integrated on a printed circuit board substrate using micro-optical assembly and packaging technology suitable for series production. For the product-oriented validation of the application advantage, an indoor localization system is realized, which achieves resolutions of less than 1 cm using the diamond magnetometer and thus a significantly improved measurement accuracy compared to current solutions.

For the integration of the micro-optical components, Finetech supplies placement and assembly systems with a placement accuracy of better than one micrometer to the project partners and provides application support in the context of photonic integration as well as for prototype construction and benchmarking of the sensors.

Finetech has over 25 years of experience in sub-micron bonding and strong expertise in handling opto and microelectronic components and is looking forward to contributing to the success of this challenging and forward-looking project in quantum sensing by providing its high-precision placement and assembly systems, process modules and application-specific bonding tools.

news-210 Wed, 19 May 2021 16:10:23 +0200 New Location for Finetech USA West Office This spring, the Finetech Arizona office relocated from Gilbert to Mesa. The new facility provides expanded machine demonstration space where customers can visit to learn hands-on about Finetech’s die bonding and rework equipment capabilities. Device samples can also be sent to the Mesa facility for evaluation and work on specific application solutions.

New address: 544 W Iron Avenue, Ste 102, Mesa, AZ 85210

Our international sales & service offices

news-208 Tue, 11 May 2021 14:08:34 +0200 Customer Story: 100% Rework Success for High Value SMD Components When a small part in your car breaks, you would find it absurd to dispose of the whole car – you repair the defective part instead. When extremely valuable assemblies worth as much as a car stop working, instead of being discarded, they are being repaired with absolute caution and care. Being a long-time partner of Finetech, Berlin-based AEMtec GmbH offers electronics manufacturing services in the sphere of high-quality technologies for miniaturization. They have purchased their first FINEPLACER® for advanced SMD rework almost two decades ago. This was the starting point for a close collaboration with a number of further projects along the way.

Finetech – when it really matters

AEMtec was developing and manufacturing complex and valuable assemblies for wafer steppers. Intermediate testing was carried out to examine proper functioning in any sub-assembly stage. This testing showed performance levels which did not match the specifications, so that several sub-assemblies had to be reworked. Thus, AEMtec approached Finetech for their comprehensive application experience. Assembly of multi-chip modules with numerous solder pads onto ceramic components resulted in some faulty connections, due to which the whole component would not function properly.  The task was to replace individual defective chips in a high-density environment without affecting other parts.

  • Two rows with 8 chips, each in the size of 5 x 15 mm2, placed with a gap of 0.5 mm
  • None of the adjacent chips should be disturbed or damaged during the rework cycle
  • 100% reliable yield needed

The rework cycle included chip desoldering, residual solder removal, precise placement and soldering of a new chip onto the component.

The challenging part of the task was the ceramics itself; its unusual thickness of more than 30 layers needed a lot of thermal input to desolder certain chips. However, the thermal energy had to be strictly focused on the defective areas to prevent it from spreading over the whole component area


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news-204 Fri, 12 Mar 2021 09:01:00 +0100 Customer Story: Prototype-to-Production Assembly of Innovative Radiation Detection Products Collaboration is one of the most important driving forces for continued growth in any business. Kromek, a leading developer of radiation detection products, has been able to meet its growth demand through an effective 20 years collaboration with Finetech and an assembly equipment pathway. Kromek is at the forefront of CZT (cadmium zinc telluride)-based radiation detector development, providing a way for medical device manufacturers to offer a scalable, modular solution for all quantitative SPECT (single-photon emission computed tomography) systems assembled into hand-held surgical cameras, thyroid imaging, molecular breast imaging, cardiac SPECT, preclinical or veterinary SPECT, and general-purpose whole-body SPECT. The change from conventional scintillator technology to CZT is like moving up from a black-and-white vacuum-tube television to a digital, high-definition, color flat-screen TV.  

Prototype-to-production assembly of array radiation detectors
John Eger, Process Engineer for Kromek, has had a nearly 20 year, long-term relationship with Finetech, installing his first 5 µm FINEPLACER® pico die bonder back in 2002.

The machine provided John the ability to prove out his concept through R&D to moderate production volume. As demand grew, the human limitations of repeatability and throughput, along with the need for higher accuracies, dictated a clear need for a new equipment solution. Finetech supported the transition to the fully-automated FINEPLACER® femto 2 bonder.

Kromek‘s volume assembly processes consist of epoxy dispense and picking and placing of multiple high density array radiation detectors with high precision. 

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news-202 Fri, 05 Feb 2021 14:33:01 +0100 Diverse and reliable assembly processes in development and production Finetech’s FINEPLACER® pico ma is a true laboratory die bonder with the virtues of a production system. A virtually unlimited range of functions, highly stable processes and up to 3 µm placement accuracy make the die bonder a cost-performance-leader. Around the world, the FINEPLACER® pico ma is the epitome of a flexible placement and die bonding system for demanding assembly tasks in prototyping, small series production, R&D labs and university purposes.

Thanks to its modular system architecture, the tabletop die bonder can be configured for a wide range of bonding technologies and applications. To meet new requirements, the system can be retrofitted and upgraded throughout its service life. With a FINEPLACER® pico ma die bonder you never have to settle and are well prepared for all eventualities.

Add to this the open, unobstructed design. Use all the freedom of the generous working area for precision assembly on particularly large substrates or expand the die bonding system with third-party functionalities. Your die bonder is capable of growing with your requirements and supports you in creative process design at all times.

With the virtues of a production die bonder
The FINEPLACER® pico ma combines this flexibility with the virtues of a genuine production die bonder. Despite manual process control, the FINEPLACER® pico ma die bonder stands for reproducibility and a high yield. Thanks to the high rigidity of the machine design and the high-resolution vision alignment system with fixed beam splitter, you always hit the target. In addition, all process modules and parameters such as temperature, time, force, flow and illumination are centrally controlled via the operating software. The integrated process management makes it particularly easy for you to focus on the core tasks in application development, to work in a structured manner and to minimize operating errors.

Whether in R&D or small volume production - the FINEPLACER® pico ma die bonder always gets straight to the point. Despite full access to all process parameters, the short setup and changeover times and the intuitive process creation save you valuable minutes of lab time every day, especially with frequently changing applications, and ensure high throughput. Numerous options for process traceability and documentation ensure common quality standards and support easy editing.

Higher placement accuracy on request
For working with particularly demanding product designs and assembly processes, the FINEPLACER® pico ma die bonder is also available with a placement accuracy of 3 µm instead of the usual 5 µm via the optionally available Zoom-Opticsplus.

Especially if you frequently work within very tight tolerances, the increased placement accuracy enables an extended process window and ensures more process reliability and yield. Thanks to the higher resolution, you can see alignment structures even more clearly and get more informative value in process documentation and in the evaluation of materials and surfaces. You have more leeway in process design and open up additional applications. Last but not least, you need to recalibrate the alignment accuracy of your die bonder less often and save further laboratory and development time.

With its economical operation, application flexibility as well as technological and functional diversity, the FINEPLACER® pico ma die bonder offers an outstanding return on investment. Thanks to its high process reproducibility in combination with the benefits of an optionally increased placement accuracy of up to 3 µm, the system can cover even demanding production tasks in addition to its traditional home in the R&D lab, as long as smaller quantities are manufactured and the switch to Finetech's fully automated solutions for high-volume production would be too early.

news-200 Tue, 19 Jan 2021 17:16:40 +0100 Customer Story: Die Bonder for the Stacking of Membrane Chips with One Micron Post-bond Accuracy The Institute for Microelectronics in Stuttgart, Germany, is using a die bonder system from Finetech for the stacking of fragile membrane chips with a post-bond accuracy of less than one micrometer. The Institute for Microelectronics Stuttgart (IMS Chips) is engaged in business-oriented research in the fields of silicon technology, application-specific circuits (ASIC), nanostructuring and image sensor technology and provides professional training. The institute partners with small and medium-sized enterprises, especially in the German federal state of Baden-Württemberg, and cooperates with leading international semiconductor companies and suppliers.

For a new application, key requirement was the stacking of a number of membrane chips, each several cm in size, on top of each other with very high precision. After completion of all placement and stacking steps, the post-bond accuracy of the overall process had to be less than 1 µm.

The previous system, an in-house design based on an old 3-inch mask aligner, reached its limits here due to a lack of spare parts and flexibility. For example, the lens distance could not be reduced, which limited the number of membranes which could be stacked on top of each other. The bonding force could not be controlled, which endangered the fragile membrane chips. Also, the adhesive for bonding the chips could not be applied in a defined manner and the overall process stability was not consistently given.

Therefore, IMS Chips were in the market for a new assembly system that would continue to ensure the highest assembly precision, but offer more flexibility in terms of supported substrate and component dimensions. The bonding force should be process-controlled and adjustable over a wide force range, and the system should also have the option of precisely applying adhesive with a dispenser.

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news-198 Mon, 19 Oct 2020 16:16:00 +0200 Customer Story: High-precision Die Bonder for the Electronic Coast® How the University of South-Eastern Norway relies on Finetech assembly and packaging equipment to facilitate innovation in one of country’s top microtechnology regions. With 20,000 students across eight locations, the State University of South-Eastern Norway (USN) is one the largest educational institutions in the country. Originating from a merger of three regional colleges, the university today offers a wide spectrum of bachelor, master and PhD courses in many scientific fields.

Besides their important role in domestic and international research and education, the USN is also traditionally deeply rooted in one of the most dynamic economic regions in the country. This is especially true for the Vestfold-based Department of Microsystems at the Faculty of Technology, Natural Sciences and Maritime Sciences, which has long been collaborating with local industrial partners in numerous R&D projects for innovations in microtechnology.
Under the Electronic Coast® brand, the USN together with close to three dozen member companies form an independent industrial association and expertise cluster, with the goal to strengthen the value creation and innovation in electronics and ICT-based companies in Vestfold and the region and to foster the development and commercialization of technology-based ideas.

Alongside the scientific perspective, the USN’s Department of Microsystems is the technological backbone, providing its partners with access to advanced lab facilities for microsystem technologies. A key element here: FINEPLACER® placement and assembly systems by Finetech.

It Started with a World’s First

Mr. Hoang-Vu Nguyen, Associate Professor at the Department of Microsystems, first learned about Finetech when visiting exhibitions at several packaging conferences in Europe and the US a couple of years back. He was impressed of the FINEPLACER®’s modular flexibility and ease of use. He thought it would be the perfect fit for his home lab and recommended the system to the department.

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news-196 Mon, 13 Jul 2020 15:47:00 +0200 Checklist - Which rework system fits your requirement profile? Are you a production or project manager of an OEM company or EMS service provider faced with the task of selecting a suitable rework system for professional SMD rework? In order to find the right solution that fits your individual requirements profile, there are numerous questions that should be addressed in advanced. This is especially important when taking into account the overwhelming market offerings.

As part of the evaluation, typical questions to consider include:

Why do you want to make an equipment investment? Is it a large individual project with consistent requirements or do you anticipate small, diverse projects with various components, substrates and materials?

Do you need a rework system with appropriate flexibility to keep all options open? Of course, technological considerations play a role, the keyword is future-proofing.
What market trends can you expect, which components/groups, substrate sizes and materials are you confronted with, which process specifications are you subject to?
The choice of the optimal heating technology is only the first of many decisions to be made.

An increasingly important issue is overall traceability and traceability of processes. If you want to be able to respond to your customers' questions, such as methodology used and how often a printed circuit board has been reworked, comprehensive documentation options are a must.

For large companies, central process development is also crucial. Can repair processes be set up once and then used throughout the company? Can it be ensured that the same results are reliably achieved on all systems?

Last but not least, there is the issue of possible internal resistance. At the end of the day, your operators must be comfortable and proficient working with the system, so ease-of-use and training are to be rated accordingly.

In order to understand the multitude of options on the market, it is best to assess in advance which type of rework system is ideally suited to your production or project requirements. This checklist, developed together with rework customers from different industries, outlines considerations for selecting your future system.

Get the full checklist

news-185 Mon, 03 Feb 2020 14:51:52 +0100 Customer Story: The Core of Highly Flexible Rework Siemens AG in Fürth, Germany, successfully uses the hot air rework system FINEPLACER® coreplus for rework tasks in the production of electronics for industrial applications. Around the globe, Siemens locations rely on Finetech systems for rework of electronic components and high-accuracy semiconductor assembly. One of them is the long-established production site in Fürth Hardhöhe, Germany. For decades, this Siemens facility has been producing electronic components, standardized and customer-specific modules and complete systems for industrial use, i.e. control and automation technology, as well as medical and energy technology.

The wide spectrum of different electronics manufactured in Fürth is unique in the realm of Siemens. It requires highly versatile production facilities, and also a very flexible approach to reworking manufacturing-related error cases at the production environment level. Not least, the rework results have to be extremely reliable, as Siemens offers its industrial customers a warranty of up to 25 years on electronic components.

However, reworking very small components and assemblies on densely populated printed circuit boards is particularly demanding. The infrared heating technology previously used by Siemens had reached its limits with regard to optimum heat distribution, so Siemens was looking for a partner that could offer a state-of-the-art solution.

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news-184 Wed, 29 Jan 2020 07:47:48 +0100 Finetech Presents at MIT’s Integrated Photonics Bootcamp On January 17, Finetech participated in Massachusetts Institute of Technology's (MIT) Integrated Photonics bootcamp, a week-long, hands-on learning experience at the MIT.nano facility.  The training allows participants to explore and learn to solve problems using lab equipment, preparing them for the challenges they will face in the workforce. The session covered precision bonding fundamentals: optics, die and substrate temperature, alignment tolerances, thermal mismatch, inert atmosphere, and force.  A review of bonding technologies included thermo-compression and thermo-sonic bonding, and UV adhesive cure.

Finetech provided a demonstration of flip-chip bonding using the FINEPLACER® lambda bonder.  Participants learned about one of the most critical bonds in a complex surface mount photonic device: the assembly of QFN low-profile quad transceiver modules using thermo-compression bonding of a VCSEL onto a sapphire substrate.  Each student had an opportunity to “drive” the equipment to get a feel for the sub-micron placement accuracy of the system.  

Anuradha (Anu) Agarwal, Principal Research Scientist at the MIT Materials Research Laboratory and Leader of the LEAP (Lab for Education and Application Prototypes) Program, was a bootcamp instructor and instrumental in organizing the program.  Following the event, Anu stated, “The Finetech team highlighted the ability of the FINEPLACER® lambda tool in achieving the desired accuracy for mounting III-V based laser dies onto an opto-electronic silicon chip. This is something desirable as we move forward with integrated photonics packaging. MIT values Finetech’s partnership in education, as we train (or re-skill) people for next generation jobs in manufacturing. We look forward to more such educational opportunities with them in the future.”

Indium Corporation, a materials manufacturer and supplier, partnered with Finetech to talk about the chemistries and physical properties of bonding materials, and the importance of using that information to select the right materials for their application. “We were pleased to have the opportunity to partner with Finetech and MIT for this event. It provided us with the opportunity to educate students and industry participants, and to learn more about Finetech equipment capabilities and the specific materials needs of the photonics industry,” said Andy Mackie, Senior Product Manager at Indium Corporation.

The general feedback from the participants was how fascinating it was to see and align such small features.  Most couldn’t wait to get their hands on the machine and try the alignment process.

news-180 Tue, 07 Jan 2020 09:37:12 +0100 Customer Story: Reworking Photodiode Arrays in the Manufacturing Process How Finetech, together with First Sensor AG, developed a complete solution for reproducible rework of faulty photodiode arrays for CT detectors. In the growing sensor market, First Sensor AG develops and produces standardized and customer-specific solutions for numerous applications. Based on proven technology platforms, a wide range of products are developed, from chips to components and detectors to sensor systems. Among other things, First Sensor is a strategic partner for leading medical device manufacturers in the field of medical diagnostics. Here, imaging procedures such as endoscopy, computed tomography (CT) scans and magnetic resonance imaging (MRI) play an important role in the identification of diseases and functional disorders and what causes them.

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news-172 Tue, 20 Aug 2019 16:16:54 +0200 With Sub Micron Accuracy from Lab to Fab Finetech's high-precision placement and assembly systems support customers from the photonics and optoelectronics industry in cost-efficient product development and transfer to automated manufacturing. With the newly introduced FINEPLACER® lambda 2 and the high-yield production platform FINEPLACER® femto 2, the Berlin-based precision machine manufacturer offers integrated equipment and process solutions for all product stages from a single source. As a manufacturer of micro assembly equipment and process technology, Finetech has been supporting start-ups, as well as global technology leaders, for almost three decades in the development of innovative semiconductor products. The highly accurate sub-micron placement and assembly systems are a cornerstone of the Berlin-based mechanical engineering company's portfolio - valued worldwide as versatile, cost-efficient and compact bonding platforms for R&D, prototyping and automated production.

They are the first choice for complex multi-stage assemblies with extremely high accuracy requirements, as well as diverse and very demanding bonding technologies. Applications include the development and production of optical transceivers up to 400 G for data communication, environmental sensors for autonomous driving, or power laser modules for use in industrial and medical applications.

FINEPLACER® lambda 2 - the starting point for successful product development
For basic research, concept and prototype phases, Finetech offers manual and partially motorized table-top systems. For this segment Finetech recently presented a new version of its long-standing successful model, the FINEPLACER® lambda.

The FINEPLACER® lambda 2 is used to place and connect components with an accuracy of better than 0.5 microns - ideal for the high requirements, e.g. in the development of opto-electronic products such as transceivers (TOSA/ROSA) or laser diode modules.

Thanks to the proven FINEPLACER® alignment and placement principle with only one moving axis, the system combines highest process quality, stability and accuracy. In conjunction with specially developed optical systems with an optical resolutions down to 0.7 µm, it enables superimposed images of the highest optical quality for the reliable detection and alignment of finest structures in the micron range.

Focus on the user
During the development of the FINEPLACER® lambda 2, Finetech put particular emphasis on the user's needs. Thanks to the ergonomic machine design and software-supported guidance, the user always remains at the center of the action.

For greater comfort and safety, all operating elements have been adapted to the typical workflow. This allows the user to concentrate on the essentials and quickly obtain results. The uniform operating concept with clearly structured process sequences also ensures quick familiarization.

The library-based toolbox design of the newly developed IPM Command operating software simplifies the preparation and modification of process sequences. Instead of predefined scripts, the user can freely create, modify and combine sequences. The visual representation of all process components and parameters in real time enables intuitive and efficient process design.

Thanks to the intelligent user guidance, user errors are minimized.

Automated processes with the FINEPLACER® femto 2
Placement and assembly processes can be automated quickly and easily on Finetech equipment. The FINEPLACER® femto 2 maintains the level of reproducibility and accuracy of the processes developed on the FINEPLACER® lambda 2, while at the same time integrating the automatic handling and process steps required for series production.

The automatic bonding platform offers placement accuracy down to 0.3 micron @ 3 Sigma and supports a wide range of assembly applications at chip and wafer level. Designed for complex applications with highest accuracy requirements and a diverse technology mix, the system is suitable for automated development environments, as well as high-yield manufacturing of high-quality semiconductor products.

The Vision Alignment System FPXVisionTM allows cost- and time-efficient passive optical placement of devices. In combination with a powerful pattern recognition, it opens up numerous possibilities for the user in terms of application flexibility and accuracy.

The FINEPLACER® femto 2 has a special housing to eliminate external interference factors and to precisely control and influence the process conditions. Filter technology ensures a protected process environment in cleanroom quality up to class 100/ISO 5 - regardless of the machine's location.

Flexibility and compatibility
Both FINEPLACER® systems follow Finetech's uniform software concept IPM Command and share the same process module base. In this way, processes which have been already qualified during the development phase can be transferred to automation without technology change or changeover effort and scaled for production.

Like all FINEPLACER® bonding systems, the machines support individual configurations. The modular architecture of the platform makes it possible to equip the machine with a multitude of extension modules for a wide range of assembly and bonding technologies, including eutectic soldering, thermocompression bonding or bonding with UV-curing adhesives. This technological diversity opens up a wide range of applications, which can be further expanded by the large bonding force range.

Thanks to the modular system architecture, the systems remain adaptable at any time: if the technology requirements change, the corresponding process module can be retrofitted by the user via plug & play.

Process development and automated production cannot be more flexible; at the same time follow-up costs are kept low and the investment is safeguarded even with changing application requirements. Ideal scenario for users who frequently want to implement new technologies and processes in the long term.

Both systems will be exhibited at Productronica 2019, hall B2, booth 411

news-169 Fri, 02 Aug 2019 08:48:24 +0200 Neuralink using Finetech bonder for packaging development work Neuralink is a neurotechnology company that’s developing implantable, ultra-high bandwidth brain–machine interfaces (BMI) to connect humans and computers.  Neuralink’s approach to BMI involves unprecedented packaging density and scalability in a clinically relevant package. The exciting and rapid advances Neuralink has made over the past couple of years has been aided by the accelerated delivery time of a Finetech precision bonder, capable of bonding die with accuracies of 0.5 µm.  Finetech recognizes Neuralink to be one of the most compelling startup companies of the last decade.

The FINEPLACER® bonders have become the “go to” solution for dozens of startup companies to create innovative products that require a pathway from prototyping to production. “Simply Accurate” is not just our company slogan, it’s a capability that assists in the development of many novel technologies.

“The ability to have a turnkey solution for our high precision die bonding is critical for us. Not only has Finetech provided this, but they’ve done so with speed and outstanding support” – Vanessa Tolosa, Neuralink

To learn more about Neuralink’s technology, watch the July 16 press conference that outlines their plans